Technical Specification

 

AAB-TECH has made continuous technological investments which have permitted to reach the best constructive characteristics you can find in the market.

 

2002
FUTURE
A

Line width outer layer

mils
4
3
B
Line spacing outer layer
mils
4
3.5
C
Line width inner layer
mils
3
2
D
Line spacing inner layer
mils
3
2
E
µVia drill diameter
mils
--
--
F
µVia pad diameter
mils
--
--
G
µVia capture pad diameter
mils
--
--
H
Drill diameter buried vias
mils
12
10
I
Pad buried vias
mils
22
18
J
Pad diameter PTH inner layer
mils
22
20
K
Drill diameter PTH
mils
12
10
L Pad diameter PTH outer layer
mils
22
20

 

 

 Products
 Technologies

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Double Side

Multilayer

Back-Panel

Flex & Rigid Flex

Alluminium PCB

Technical Specification